Intel is not going to delay the transition to 450-mm wafers

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POSTER: computer news   ||   INTEL IS NOT GOING TO DELAY THE TRANSITION TO 450-MM WAFERS	DATE:2013-10-16
In August this year we reported that Intel starts preparing its production facilities located in Oregon , the transition to the processing of silicon wafers 450 mm size.  Now leading semiconductor manufacturers use silicon wafers with a diameter of 300 mm, the transition to a larger size will increase output and reduce unit costs, but only if they meet the demand level .   On a quarterly report conference, analysts asked Intel head  , the company is not going to roll funding for the preparation for the transition to the use of silicon wafers 450 mm size.  As explained Krzhanich, no change in  Intel plans has  happened.  Together with its partners in the face of TSMC and Samsung Corporation continues to work towards the implementation of a new wafer size.    It is planned that the production of microchips from silicon wafers 450 mm size will be mastered in the second half of the decade. Related Products :

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