The integrated AMD processors - APU Carrizo - can rely on stack memory High-Bandwidth Memory. This memory is a layer cake - at least four of the crystal memory, connected to a vertical stack using TSVs-through connections. It should be also said that JEDEC committee previously approved appropriate standard, so HBM samples are already available for the study and integration of products and experienced, according to the slides, Hynix company has more than 21 third-party tools, resting on its chips HBM.
The first generation of memory High-Bandwidth Memory is based on four crystal capacity of 256 MB. Accordingly, the chip assembly will have a capacity of 1 GB. Bus width memory access is 1024 bits. When the rate at 1 Gbit / s per pin data rate will be 128 Gbytes / sec. For comparison, the speed of data exchange with the GPU of GeForce GTX 750 Ti reaches 86 GB / s. In the case of increasing the speed of transmission of HBM up to 2 Gbit / s per pin, the exchange rate will increase to 256 GB / s. At the following stages of HBM development is expected to increase the rate of exchange to 512 and even 1,000 GB / s.
According to Hynix plans , the company will produce memory HBM as a 4-crystal 1GB stacks on the basic 2-Gbit crystals to the first and second quarters of 2016. Then base crystals become 8-Gbps solutions. The company will begin to pack up to 8 crystals in the stack, which will output the chip HBM capacity up to 8 GB. Related Products :
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