Intel talked about the nature of 3D XPoint memory, which it has developed a partnership with Micron and promises to be 1000 times faster than flash NAND-type.
Both the developer kept secret mechanism of 3D XPoint memory. According to Krzhanicha memory 3D XPoint "is slightly different from the memory PCM". The chemical processes in the cell 3D XPoint very unique. It's not a pure PCM, because the material used with a monolithic structure. It looks like 3D XPoint memory is closer to the type of memory PCM, than resistive ReRAM. In the near future, Intel promises to share detail about the principle of 3D XPoint.
Also Intel contemplating the unique interface for connecting memory system on 3D XPoint the processor.
Krzhanicha also asked about the problems with the production based on the latest technical processes that caused the overlap of two processors generations announcements at each other (Broadwell and Skylake). All the fault, according to Intel, difficulty in mnogomasochnoy projection that forced the company to use the production of processors with a smaller and smaller scale process technology standards. If EUV-lithography was introduced into production a few years ago, the problem would not have arisen. So far, Intel is forced to state the that the concept of tick-tock have changed.
Next year, according to Intel director , could be decisive in terms of certainty, whether the 7-nm process is mastered using EUV-scanners, or without them. Process technology to 10-nm can be made without new equipment. By the way, the company also has not yet decided on the frozen factory Fab 42 in Arizona. In 2011, Paul Ottelini President Obama vowed that the new Fab 42 plant will be built for the production of 14-nm processors, and will enter into service in 2013. Subsequently, the project was stopped . The fate of the factory will also be determined in the next year. Related Products :
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