Huawei company, introduced in October chip Kirin 960 , is already working on a next flagship CPU for mobile devices. Â The new single-chip platform, as one would expect, dubbed Kirin 970.
According to PhoneArena the edition, Kirin 970 will show a great leap forward in terms of performance compared to the Kirin 960. The structure of the new single-chip platform will include Huawei eight cores and an integrated "global» LTE-modem. Â
Kirin 970 will be built on 10-nanometer rules, while Kirin 960 as Kirin 950, made on 16-nanometer FinFET process technology. Â
The debut of the new chip Kirin 970 expected in 2017. Â It must compete with the new 10-nanometer processors, Samsung, Qualcomm and MediaTek.
Recall, Â Kirin 960 includes a quad-core Cortex-A73, quad-core Cortex-A53 with big.LITTLE architecture, graphics accelerator Mali-G71 MP8 and LTE-modem LTE Cat.12 / 13 support. Â Its effectiveness compared with Kirin 950 increased by 15%.