According to experts, the current division of lithographic technology on stage is very conditional. Should we be surprised that TSMC has decided to turn the fourth version of the 16-nm process technology in its performance in the so-called 12-nm process? The publication DigiTimes claims that TSMC will be presenting everything regularly. At the very least, to its clients this stage it will offer technical process as something distinct from the 16-nm technology.
Even Japanese sources confirm that TSMC already offers three 16-nm technology: 16FF, 16FF + and 16FFC. The advent of 12-nm process technology at TSMC production program will allow the company to compete better with GlobalFoundries and Samsung, which offer 14-nm process technology. By the way, the same 28-nm TSMC already offers six options. Japanese sources simultaneously confirm TSMC intention to develop a 7-nm technology without the use of so-called of EUV-lithography. While Samsung
is still in splendid isolation, with the exception of its "technological donor," IBM, speaking of the desire to use the UEV-lithography elements in the production of 7-nm products.
If we talk about the success of "native Chinese" manufacturers of semiconductor products, SMIC and HLMC going to master the 14-nm process by 2020, which are prepared to re-equip the production capacity, working with silicon wafers 300 mm size. Related Products :
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