ASML turns working off the transition to silicon wafers size 450 mm

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POSTER: computer news   ||   ASML TURNS WORKING OFF THE TRANSITION TO SILICON WAFERS SIZE 450 MM	DATE:2013-12-22
The economic crisis in 2008 forced the Dutch lithography equipment maker ASML to sell 15% stake to Intel, still got five TSMC and Samsung - holding major customers who have agreed to share the financial burden of the future technical upgrading. As reported earlier this month Dutch resource Bits & Chips, ASML Holding has confirmed the suspension of work on the creation of equipment to process silicon wafers 450 mm size.  In the relevant development has invested more than 1.38 billion euros, the main customers were Intel, Samsung and TSMC. According to ASML representatives  , it comes from customers initiative to suspend the relevant work.  Reasons for such a decision without comment.  Until now it was thought that the mass production of chips using silicon wafers 450 mm diameter will begin in 2018.  By the time Intel, for example, had to go to 7-nm process.  ASML says that it is ready to resume work in this area as soon as customers wish. Related Products :

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