GlobalFoundries reports on improving the technology to create feedthroughs

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POSTER: computer news   ||   GLOBALFOUNDRIES REPORTS ON IMPROVING THE TECHNOLOGY TO CREATE FEEDTHROUGHS	DATE:2014-03-21
A year ago, GlobalFoundries announced the creation of an experienced 20-nm silicon using feedthroughs (TSVs).  Subsequent searches have allowed the company to move in this direction in terms of improving the technology.  So, GlobalFoundries able to adapt the design for the manufacture of semiconductor multilayer 3D-structures and thus was able to increase the efficiency of the chip area in each layer. By estimations of experts, the same GPU can contain up to 10,000 feedthroughs.  Around each channel in the manufacturing process of the semiconductor layer pattern is formed in the unused area, which may reach 113 microns square.  Proposed by GlobalFoundries technology allows four times to reduce clogging of the crystal, and this is an extra transistor budget and cost reduction.  The main difficulty with this was that in the process of heating the working circuit in the contact point there are mechanical stresses which can lead to failure of the output circuit.  Coefficient of thermal expansion of copper and silicon is different, so the connection remains weak, they are trying to compensate by playing with the chemical composition of the contact and protective layers.  By the way, the company offers Tezzaron used to fill TSVs-channels instead of copper tungsten, thermal expansion coefficient which is close to that of silicon. Related Products :

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