In late July, during the announcement of the revolutionary non-volatile memory 3D XPoint Intel and Micron leadership assured that the products in the present embodiment will go on sale in 2016. In the autumn session IDF in 2015, which started two days ago, Intel CEO - Brian Krzhanich - not only confirmed these terms, but also was able to demonstrate the early prototype storage device with memory 3D XPoint.
The prototype SSD memory on the 3D XPoint was made in the form with the bus PCI Express. PCIe-model DC P3700 (established read and write speeds reach 2.8 / 1.9 GB / s, and the values for IOPS random read and write - 460000/180000 operations). In the course of the competition in the storage memory 3D XPoint in terms of IOPS 5-7 times exceeded the speed of the SSD DC P3700. It's not something a 1,000-fold superiority, which Intel declares , talking about the merits of 3D XPoint, but still impressive.
The company admitted that the full potential of 3D XPoint memory can only be a new computer architecture. Today, all the major developers are working on this issue. It is significant that Intel now also belongs to one of them. Obviously, high-speed non-volatile memory, which can replace the cache as part of the processor and system memory to significantly change the paradigm of functioning computers.
Products on the base of memory 3D XPoint go on sale in 2016 under the brand Optane. Releasing the company Micron memory is using 20-nm process technology. In addition to the SSD form factor 2.5-inch solid state drives in the memory will be released in 3D XPoint other form factors SSD, as well as modules DDR4 memory for Intel server platforms . Related Products :
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