IBM 32nm process ready
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POSTER: computer news || IBM 32NM PROCESS READY |
DATE:2008-04-15 |
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IBM company yesterday reported about the first successes in 32 nm technological process mastery . This success was achieved by the hole partners group : IBM , and also Infineon, ST microelectronics, Chartered semiconductor, Freescale, Samsung and Toshiba.
Intel company already uses materials with high dielectric constant value (high- k) within the 45 nm technical process, As in case with intel processors , new IBM generation microcircuits will use transistors with metallic lock.  The combination of these two innovations allows either to increase the performance level by 35% in comparison with 45 nm products or reduce the energy consumption level by 30 - 50% depending on the operating voltage.  Memory cells on base of 22 nm technology, can appear already at the beginning of 2009. Product on base of 32 nm technology will be available already in the second-half of 2009, the first trial parties can be ordered at the end of this year. TSMC Company intends to begin the release of 32 nm product in the fourth quarter 2009. Related Products : | ||
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IBM 32NM PROCESS READY |
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