In early September, a developer and manufacturer of programmable FPGA-matrix - Altera company - announced the release of kits for the evaluation of a new memory type in the face of Hybrid Memory Cube (HMC). At the same board were four high-performance SoC Altera and only one memory chip HMC from Micron production . The capacity of this memory at this stage is 160 Gb / s, allowing it to provide access to both the four processors no limit for each of them. In this case, the capacity of one chip HMC is 2 GB, which is equivalent to a single strip of memory.
From now on, Micron company , engineering samples of the 2-GB memory HMC available to the public. In early 2014, the company expect to start production of engineering samples Hybrid Memory Cube 4GB. However, the company did not disclose details about the composition of these chips, as no data on the technical process, in which Micron manufactures HMC. Theoretically, a stack of memory chips and a controller may consist of 9 layers. 2 GB chip, as seen in the photo, made up of 5 layers, 4 of which - a 4-Gbit memory.
However, it remains unknown who released engineering samples Hybrid Memory Cube. Micron company , possibly at its factory such technology is not yet mastered. But its partner in the development of specifications HMC - Samsung company - can not only connect the crystals with through channels, but also produce real three-dimensional semiconductor structures. In other words, if HMC memory will get a strong demand, Samsung without any problems start producing such a memory. According to Micron estimates , serial production of Hybrid Memory Cube for commercial use will do not start at the end of 2014, then in 2015. At first, it will supply the specific needs related to the scope of FPGA use and specialized SoC. In the consumer electronics memory Hybrid Memory Cube will be no earlier than 3 years, and even after 5 years.
Memory Micron Hybrid Memory Cube - is a special case of the so-called broadband memory HBM (High Bandwidth Memory). There are several standard HBM, specifications developed by sectoral committee JEDEC.
In general, it is about expanding the bit interface circuits up to 1024 bits (standard Wide I / O), using cross-connections (TSVs) and moving the controller in the chip. This type of memory, for example, is going to be used in the architecture of NVIDIA Corporation in 2015 under the code name of Volta .
Related Products :
|