For some time, Intel has decided that there is nothing wrong in providing contract manufacturing of semiconductor products to third parties that they are not in direct competition with the processor giant. Investments in advanced lithography technology is becoming more and traditional markets shrink Intel .
For example, yesterday, Intel announced intentions to produce commissioned by Panasonic chip highly integrated 14-nm technology standards for devices with low power consumption, using a so-called three-dimensional transistors. What kind of chips Intel will receive from the Japanese company Panasonic, is not specified, but they will be used in audio and video equipment. Advanced process technology, according to the Panasonic, should provide high performance with low power consumption.
Panasonic has become the sixth client of contract Intel unit. Services of Intel already enjoy Altera, Achronix Semiconductor, Tabula, Netronome and Microsemi. According to Intel representatives , service contract manufacturing of chips remain important for the company's strategic direction. It is interesting that Intel is considering operations packing chips issued for customers to third parties. In this case, customers will receive from Intel silicon wafers with chips and placing them in the case and will be engaged in testing already specialized contractors. Intel representatives are confident that the company will be able to switch to 10-nm technology without involving lithography equipment with superrigid ultraviolet (EUV). This does not mean that this migration from Intel refuses altogether: in addition to the larger standard size of silicon wafers (450 mm), the transition to EUV-technology is a welcome change for the company.