Micron company , which is in the field of solid-state memory production is a close Intel partner , recently made a statement about the absence of the need to introduce lithography with superhard ultraviolet (EUV) in the framework of technological processes of so-called "10-nanometer class" - from 19-nm to 10 nm, if we consider the limits.
ASML Holding, which is engaged in production necessary for the production of semiconductor lithography equipment products, today issued a Quarterly report , a certain part of the report devoted to the success of the preparations for the transition to the use of EUV-lithography. The company emphasizes that the interest in EUV-equipment manufacturers demonstrate how logic chips and processors, and memory manufacturers. One analyst asked the Director General of ASML, in what time frame EUV-lithography will be implemented in the production of memory chips.
Praising analyst for a good question, the head of ASML Vennink Peter explained that memory manufacturers multistage structuring already used, and sooner or later, this method would complicate their lives so that it is cheaper to go to the EUV-lithography. It will happen, according to the head of ASML, in the area of the implementation period 14-15-16-nm process technology. The density of the placement of the elements to grow so much that it will cause memory manufacturers move to lithography with superhard ultraviolet radiation.
Recall that in the field of EUV lithography, Samsung and GlobalFoundries production processors promise partially implemention in the framework of 7-nm technology in 2018, Intel and TSMC prefer to wait for the move to 5-nm process technology.